Our team has conducted extensive research to compile a set of PCB Design MCQs. We encourage you to test your PCB Design knowledge by answering these 60+ multiple-choice questions provided below.
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A. A copper film
B. A polyester film
C. A photographic glass
D. A tri-acetate film
A. Immersion plating
B. Electroless plating
C. Hard plating
D. Electroplating
A. common ground conductor networks
B. independent ground conductor networks
C. no ground conductor network
D. None of the above
A. band pass filters
B. band elimination filters
C. directional couplers
D. All of the above
A. epoxy smear is removed and the exposed glass fibers prepared for copper deposition
B. epoxy smear is deposited and the exposed glass fibers prepared for copper removal
C. etchants are removed again
D. None of the above
A. true
B. false
C. sometimes true and sometimes false
A. a diode
B. a transistor
C. an IC
D. any commonly used electronic component
A. 50-100ohm
B. 100-150ohm
C. 150-200ohm
D. 200-250ohm
A. broader signal conductors
B. thin signal conductors
C. both a and b
A. photo printing
B. screen printing
C. hand printing
D. All of the above
A. Sanding
B. Water rinse
C. Wet brushing
D. Scrubbing
A. Current carrying capacity of the conductors
B. Bending
C. Contours
D. All of the above
A. 100°c
B. 200°c
C. 350°c
D. 450°c
A. Etching
B. PCB finishing
C. PCB layout
D. PCB artwork
A. l > Tr/100 nsec ( Tr- rise time of pulse)
B. l > 2Tr/100 nsec
C. l > Tr/200 nsec
D. l > 2Tr/50 nsec
A. Flame resistance
B. Water absorption
C. Flexural strength
D. Color
A. impedances
B. transmission lines
C. capacitors
D. inductors
A. remove etchants
B. remove excess copper
C. withstand thermal shock due to soldering
D. clean a PCB with chemicals
A. permeability
B. permittivity
C. proximity
D. resistivity
A. Dip soldering
B. Drag soldering
C. Wave soldering
D. All of the above
A. Substance additive processing
B. Additive processing with catalytic adhesive
C. Semi-additive processing
D. Both a and b
A. Sheet metal covered with insulation material
B. Cardboard
C. Foil with insulation
D. None of the above
A. Tin lead
B. Tin antimony
C. Tin silver
D. Iron lead
A. Solvent developing dry film resists
B. Liquid developing dry film resists
C. Hand developing dry film resists
D. All of the above
A. 30°C
B. 10°C
C. 45°C
D. 100°C
A. R*A / l R- resistance measured
B. R*l / A A-area of gourde electrode (cm2)
C. A*l / R l-thickness of sample(cm)
D. R / A*l
A. О
B. €
C. Ө
D. β
A. low attenuation per unit length
B. high attenuation per unit length
C. low impedance per unit length
D. high impedance per unit length
A. resist
B. etchant
C. board cleaner
D. a soldering material
A. Iron soldering
B. Hot gas soldering
C. Radiant heat soldering
D. All of the above
A. Epoxy resin
B. Polyester foil
C. Teflon foil
D. All of the above
A. Filler
B. Resin
C. Silver foil
D. Copper foil
A. 5-10cm
B. 5-10mm
C. 5-10um
D. 5-10nm
A. removing the TTL circuit
B. replacing transistors with diodes
C. using a ground line
D. All of the above
A. Electrical and metallographic test
B. Continuity between layers test
C. Insulation resistance between layers test
D. All of the above
A. semiconductor losses
B. conductor losses
C. insulator losses
D. None of the above
A. Photo printing
B. Hand printing
C. Screen printing
D. Both a and c
A. Post backing
B. stripping
C. touch up
D. dyeing
A. 18"
B. 19"
C. 20"
D. 21"
A. conductor on the ground
B. conductor below the ground
C. conductor above the ground
D. None of the above
A. ECL-ICs
B. TTL-ICs
C. RTL-ICs
D. CMOS -ICs
A. Clearance holes
B. Plated through holes
C. Fused tubelets or eyelets
D. All of the above
A. capacitive and inductive coupling between power circuits
B. crosstalk
C. only inductive coupling
D. only capacitive coupling
A. do decoupling of power supply conductors with sufficiently large capacitors
B. do decoupling of power supply conductors with small capacitors
C. not to do any decoupling
A. high
B. low
C. same
A. Corrosive fluxes
B. Intermediate fluxes
C. Non-corrosive fluxes
D. All of the above
A. Where the overall PCB dimensions and interconnections are not feasible on a double-sided PCB
B. Where reduction in electronic equipment weight and volume is the prime concern
C. Where decoupling and shielding of the interconnections is important
D. All of the above
A. VSWR > 1
B. VSWR < 1
C. VSWR exactly 1
D. VSWR equal to zero
A. they can not be used for low frequency applications
B. they are not suitable for high frequency applications
C. they can be used only in military applications
D. they can used only in aerospace applications
A. 20×70 mm
B. 10×50 mm
C. 20×70 cm
D. 10×50 cm